Technology At Verretec
By combining a vertically integrated manufacturing platform with the latest glass melting and textile
technologies, Verretec's products are able to surpass many of the traditional performance standards
of continuous glass reinforcements.
STRONGER
Verretec’s FlatFiber™ fabric is significantly stronger than traditional glass fabric, resulting in composite laminates that exhibit superior mechanical properties.
THINNER & FLATTER
For the same weight and glass content, Verretec’s FlatFiber™ fabric is significantly thinner and flatter than traditional glass fabrics.
MORE UNIFORM
Verretec’s FlatFiber™ technology uniformly distributes fibers in the x - y direction, minimizing weave knuckles and fiber voids, and yielding a highly consistent, truly isotropic substrate.
IMPROVED ELECTRICAL & THERMAL
Verretec’s DirectFinish™ technology applies sizing to each individual glass filament (not simply the surface of the yarn bundle like other glass fabrics), providing a superior interface between glass fiber and resin that yields improved electrical and thermal performance.
SMOOTHER COATING
Verretec’s glass fabric is less porous than other glass fabric due to its FlatFiber™ construction and x-y uniformity, resulting in a consistently smooth surface, where pinholes and exposed fibers are minimized, and coating material usage can be significantly reduced.
IMPROVED DIMENSIONAL STABILITY
Verretec’s unique FlatFiber™ technology eliminates all yarn twist, resulting in a fabric with superior strength and uniformity, yielding improved, and more predictable, dimensional stability in rigid laminates.
IMPROVED DRILLING & MACHINING
Verretec’s FlatFiber™ construction minimizes weave knuckles and distributes glass fibers more uniformly, resulting in improved quality and efficiency in drilling and machining operations.
IMPROVED RESIN-
REINFORCEMENT INTERFACE
Verretec’s DirectFinish™ technology provides a superior interface between the glass fibers and the resin matrix, thereby helping to reduce the incidence of composite failures such as CAF failures in printed circuit boards.